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Reference #: R018601 Please Note: 1. If you are a first time user, please create your candidatelogin account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description:

Position Overview: Located in Breinigsville, PA our high volume, 24/7 manufacturing facility produces products to enable fiber optic communication expansion. As a Wafer Fab Process Engineer, you will develop, improve and sustain wafer fab processes including photolithography, dry etch, wet etch and thin film deposition processes for Indium Phosphide laser and detector device manufacturing.

Responsibilities:

Developing, improving, and sustaining wafer fab processes including photolithography, RIE/ICP dry etch, wet etch and thin film deposition processes for high volume photonic integrated circuit manufacturing.

Conducting data analysis, failure analysis, and yield improvement

Plan projects including design of experiments, lead/take ownership of projects to develop/qualify new processes and tools, complete projects on time and within budget

Maintaining or defining process standard operating procedures, providing instructions to operators for wafer processing

Maintaining or defining quality management standard including creating and reviewing SPC charts for robust quality control

Maintain a working knowledge of safety policies and regulations to ensure duties of self and others are performed in a safe manner

Work with equipment technicians to resolve process/equipment issues

Qualifications and skills:

Master's degree in Physics, Electrical/Chemical/Material/Mechanical engineering or related fields with 3+ years of related experience. Bachelor's degree in Physics, Electrical/Chemical/Material/Mechanical engineering or related fields with 5+ years of related experience will be considered.

Hands-on semiconductor wafer fabrication experience, preferably from a InP semiconductor production environment or compound semiconductor manufacturing environment

Direct experience in RIE/ICP, wet chemistry, thin film deposition, photolithography

Familiar with material & process characterization methods

Hands on SEM/EDS experience a plus

Experience in using SPC, DOE and Lean manufacturing methods, JMP experience a plus.

Strong problem solving, teamwork, and communication skills

Being able to work outside of normal business hours when needed

Key words: Wafer Fab, Indium Phosphide, InP, Semiconductor, Laser, Diode, Optical Semiconductor, cleanroom, statistical process control, nanotechnology, microelectronics, Lehigh Valley, Allentown, PA

Additional Job Description: Compensation and Benefits The annual base salary range for this position is $78,000 - $130,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Broadcom Inc. is commit ed to creating a diverse work environment and is proud to be an equal opportunity employer.